Component launches, lifecycle changes, sourcing developments and regulation—with the implications for UK electronics design and purchasing teams.
Vishay has introduced four SOT-227 power modules using 650 V superjunction MOSFET technology, aimed at drop-in use in existing designs.
Infineon has inaugurated a greenfield backend manufacturing site near Bangkok, designed to scale to five modules as part of its global capacity diversification.
Wärtsilä, Schneider Electric and Stanley Consultants have set out a coordinated approach intended to reduce gaps between generation, distribution and computing loads.
The US specialist is adding EU data hosting, European distributor links, language support and currency conversion ahead of electronica in November.
The company-supplied system integrates temporary bonding, debonding and detaping, with ERS reporting throughput of 13 panels an hour and a first customer delivery.
The companies say all necessary regulatory clearances have been received, removing a major condition but not itself completing the transaction.
TDK's B3272*A/G/T DC-link film capacitor series is qualified for continuous operation at case temperatures up to +135°C, with no derating below +105°C.
The Near-DUT platform supports emerging DRAM and NAND interfaces, with production and engineering configurations built around common hardware and software.
The KA85010UA combines conventional battery monitoring with electrochemical impedance spectroscopy, with samples scheduled for January 2027.
Renesas is sampling a 650V GaN device in a dual-side-cooled 8x8mm package aimed at 800V HVDC power stages in megawatt-scale AI data centre racks.
Microchip has added 10BASE-T1S transceivers and an integrated endpoint family aimed at simplifying zonal Ethernet architectures in vehicles and industrial systems.
Vishay Sfernice has released an Automotive Grade thick film power resistor rated at 35 W in a surface-mount TO-263 (D²PAK) package designed for top-side heatsink cooling.
STRATUM 9 has released a DECT NR+ gateway it says brings deterministic wireless links to moving industrial equipment via existing Ethernet infrastructure.
Infineon will supply silicon carbide power devices for Eaton's medium-voltage solid-state transformer platform aimed at 800 VDC AI data centre power architectures.
Analyzer 26.10 uses an AI agent to prepare verification work while the formal engine performs the analysis and reports MC/DC coverage.
Its Autopilot platform coordinates engineering agents across verification, implementation, analogue design and simulation, with broader availability planned this year.
ContactGlove3 Pro incorporates a compact three axis antenna for capturing finger movement and robot control input.
The orderable substrate has a published micropipe limit below 0.01 per square centimetre as device makers assess yield and supply at 200 mm.
The MATLAB and Simulink release adds tools for managing model variants and testing embedded code, alongside updates for vision, point clouds and AMD SoC design.
NXP and VIS joint venture VSMC has completed its first 12-inch specialty fab in Tampines, targeting volume production in Q1 2027.
The TLx49012 family aims to reduce calibration work in automotive and industrial motor control while offering several output interfaces.
The carmaker will assess electrical, thermal and safety performance before deciding whether the cells are suitable for future vehicles.
Seeed Studio has released two XIAO development boards combining Nordic's nRF54LM20A SoC and nPM1300 PMIC for battery-powered IoT designs.
The proposed all stock acquisition brings spatial model research into AMD as it studies the computing needs of emerging AI workloads.
Sapphire RV64 adds larger memory options, caches and optional Linux support across Efinix FPGA devices.
