Single-board computers, COMs and SOMs, industrial PCs and wireless modules. Buying a subsystem rather than designing one.
The MATLAB and Simulink release adds tools for managing model variants and testing embedded code, alongside updates for vision, point clouds and AMD SoC design.
Seeed Studio has released two XIAO development boards combining Nordic's nRF54LM20A SoC and nPM1300 PMIC for battery-powered IoT designs.
The licensable I/O IP lets advanced-node chips connect to higher-voltage parts, with integrated ESD protection and a regulator for the 3.3 V N4C implementation.
IBASE has introduced a 3.5-inch single-board computer built around Intel Core Ultra 300 Series processors, with up to 180 TOPS of combined CPU, GPU and NPU performance in its highest configuration.
Renesas has launched the SLG46801, a multi-time programmable GreenPAK configurable mixed-signal IC offered in a 9-ball 1.155mm x 1.155mm WLCSP or a 12-lead STQFN package.
The BL54LM20A and BL54LM20B share a module footprint and RF design, giving developers a route to add on-device inference later in a product programme.
A component can remain electrically available while its firmware, signing keys or update path becomes the real lifecycle constraint. That changes what design managers need to record.
A quick route to working hardware can leave a longer support job. Check the module, carrier board and software commitments before choosing the production platform.
Microchip has closed its acquisition of Hailo, adding AI accelerators and vision processors to its embedded portfolio, with undisclosed terms.
Arrow Electronics has added NXP's Ara240 neural processing unit to its Digital Test Drive platform, letting engineers test the device remotely before buying hardware.
A fictional design-team case about intermittent I²C errors that appear only after twenty minutes at operating temperature.
