New components, applications and engineering developments, explored by The Electronics Brief and contributing technology companies. This section includes editorial coverage and paid features; paid contributions are identified on the relevant item.
A thermal camera measures the package surface. Assessing the junction temperature needs the right device data, a defensible power figure and a record of the test conditions.
A wireless module reduces integration work, but the enclosure, ground plane and nearby hardware remain part of the RF design. Reserve time to test the product you will ship.
The RZ/G3L and RZ/G3SE are intended to support display and headless variants on a common PCB. Teams still need to validate memory, power, software and peripheral assumptions for each build.
Six capacitor series now extend to 500V, but voltage rating alone does not settle lifetime, ripple-current or thermal selection in an AI-server power supply.
