Vehicle electronics, EV powertrain, charging and ADAS, and the AEC-Q qualification burden that comes with them.
Gotion will invest €1.1 billion for a 49% interest in PowerCo’s Valencia battery operation. The agreement brings LFP production closer to European vehicle plants while exposing the technical and industrial depth required to localise the complete battery system.
TDK's B3272*A/G/T DC-link film capacitor series is qualified for continuous operation at case temperatures up to +135°C, with no derating below +105°C.
The KA85010UA combines conventional battery monitoring with electrochemical impedance spectroscopy, with samples scheduled for January 2027.
Microchip has added 10BASE-T1S transceivers and an integrated endpoint family aimed at simplifying zonal Ethernet architectures in vehicles and industrial systems.
Vishay Sfernice has released an Automotive Grade thick film power resistor rated at 35 W in a surface-mount TO-263 (D²PAK) package designed for top-side heatsink cooling.
The TLx49012 family aims to reduce calibration work in automotive and industrial motor control while offering several output interfaces.
The carmaker will assess electrical, thermal and safety performance before deciding whether the cells are suitable for future vehicles.
Vishay Intertechnology has introduced four Sfernice thick film resistor sample kits covering 20 W and 35 W surface-mount devices for automotive and industrial design validation.
OMNIVISION has introduced a companion processor designed to add parking surveillance to existing exterior vehicle camera systems without requiring the main computing platform to remain continuously active.
Diodes Incorporated has introduced four 60 V field plated Super Barrier Rectifiers for power conversion, battery charging, reverse polarity protection and automotive lighting.
Microchip has launched the PAC1761 and PAC1861 digital power monitors, which track accumulated energy use alongside instantaneous readings for 48V system designs.
onsemi has unveiled the Embedded Power Platform, which uses the silicon wafer itself as the package, with sampling to strategic customers expected in 2026.
Vishay has introduced four surface-mount rectifier series rated 5 A to 12 A in a new 0.88 mm DFN6546A package with wettable flanks, some in AEC-Q101 qualified versions.
STMicroelectronics has introduced the VD56GA, a 1.1 megapixel infrared image sensor aimed at scaling driver and occupant monitoring to higher-volume vehicle platforms.
Vishay has introduced a 15-device XClampR bidirectional TVS series in DO-218AC, targeting automotive and industrial transient protection with a clamping ratio close to 1.0.
TDK has expanded its CN series with a soft-termination 100 V, 10 µF X7R MLCC in the 3225 case size, aimed at 48 V power lines in AI servers, humanoid robots and xEVs.
The joint demonstrator uses ASA Motion Link to send graphics and video from a vehicle’s central computer to its displays.
