Parker Chomerics launches reusable 3.0 W/m·K thermal gap filler pad

Parker Chomerics, the Engineered Materials Group division of Parker Hannifin, has launched Therm-A-Gap Pad 30RB, a thermally conductive gap filler pad rated at 3.0 W/m-K. According to the company, the material can be compressed and reapplied multiple times with minimal loss of thickness while maintaining the thermal performance of a fresh pad, a rebound characteristic aimed at applications involving more than one assembly cycle.

The pad is intended to accommodate high stack-up tolerances between components, helping to minimise compressive loads and absorb shock while requiring only low compression force. Parker Chomerics also cites vibration-dampening properties. Suggested applications include chipset testing, automotive electronic control units (ECUs), telecommunications equipment, consumer electronics and computing devices such as desktop PCs, laptops and servers.

Electrical and thermal specifications

Therm-A-Gap Pad 30RB carries a thermal impedance of 2.9 °C-cm²/W. Electrical properties include a dielectric strength of 0.02 kVac/mm, measured to ASTM D149, and a volume resistivity of 10¹³ Ω-cm, measured to ASTM D257. The RoHS-compliant material has an operating temperature range of -55°C to +200°C, carries a UL 94 flammability rating and has a stated shelf life of 24 months from shipment.

Formats and construction

The pad is naturally tacky on both sides to hold position during assembly, and is also available with one non-tacky surface for applications requiring different handling. It is offered in thicknesses from 0.51 mm to 5.08 mm in 0.254 mm increments, in standard sheets measuring 228.6 x 228.6 mm. Carrier options are aluminium foil or Kapton thermally enhanced polyimide film, with pressure-sensitive adhesive available only on the aluminium foil carrier. Parker Chomerics states it can also supply custom widths, lengths and die-cut parts, either as individual pieces or on sheets.