TDK adds low-resistance 100 V, 10 µF X7R MLCC in 3225 case

Illustrative image: Sergei Starostin on Pexels
TDK Corporation has expanded its CN series of soft-termination multilayer ceramic capacitors (MLCCs) with a new 100 V, X7R-characteristic device rated at 10 µF in the 3225 case size (3.2 x 2.5 x 2.5 mm). Mass production began in September 2026.
The CN series uses a proprietary resin electrode structure that TDK says gives soft-termination MLCCs the same low terminal resistance as its standard-termination products, addressing the higher equivalent series resistance (ESR) that resin layers typically introduce as a safeguard against MLCC cracking caused by external stress.
TDK states the new devices achieve twice the capacitance of its conventional capacitors of the same size while significantly reducing ESR, and says this allows the number of MLCCs used and the mounting area in a design to be halved.
TDK points to growing use of 48 V power lines in AI servers, humanoid robots, xEVs and industrial equipment, driven by efforts to cut power loss and wiring-harness weight, as increasing demand for higher-capacitance 100 V-rated MLCCs on those lines.
Two part variants are listed: CNA6P1X7R2A106K250AE, qualified to AEC-Q200 for automotive applications, and CNC6P1X7R2A106K250AE for general commercial use, both with a capacitance tolerance of ±10 percent. TDK describes the 10 µF/100 V rating in this case size as industry-leading as of September 2026.



