Vishay adds top-side cooled power resistor in D²PAK package
Illustrative image: Cameron Edwards on Unsplash
Vishay Intertechnology has introduced the Sfernice D2TO35S, an Automotive Grade thick film power resistor in the surface-mount TO-263 (D²PAK) package, designed to transfer heat through its top side to an external heatsink rather than through the PCB.
Thermal design and power handling
The device dissipates 35 W at 25 °C. Vishay states that, when paired with an appropriate heatsink, the top-side cooled architecture enables up to nine times greater power dissipation than standard PCB-mounted devices, a comparison the company attributes to its own testing.
Vishay says the approach allows designers to raise power dissipation within the same footprint, or achieve equivalent performance in a smaller footprint, while lowering PCB temperatures and reducing thermal stress on neighbouring components.
Key specifications
- Resistance range: 4.7 Ω to 550 kΩ, tolerances down to ±1 %
- Thermal resistance: 4.28 °C/W
- TCR: down to ±150 ppm/°C
- Operating temperature: -55 °C to +175 °C
The D2TO35S has a non-inductive design intended to support signal integrity and power handling under fast transient conditions. It is RoHS-compliant and rated solder reflow secure at 270 °C for 10 seconds.
Vishay states that samples and production quantities are available now, with lead times of fourteen weeks.
