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Renesas shrinks GreenPAK to 1.155mm WLCSP with in-field reprogramming

Renesas has launched the SLG46801, a multi-time programmable GreenPAK configurable mixed-signal IC offered in a 9-ball 1.155mm x 1.155mm WLCSP or a 12-lead STQFN package.
Official press image: Renesas shrinks GreenPAK to 1.155mm WLCSP with in-field reprogramming

Image: Renesas

Renesas has introduced the SLG46801, which it describes as the smallest WLCSP-packaged GreenPAK device it has produced, aimed at designers needing analog, timing and logic functions in very tight board space.

The device is offered in two package options: a 9-ball WLCSP measuring 1.155mm x 1.155mm, and a 12-lead STQFN measuring 1.6mm x 1.6mm x 0.55mm. Renesas says the STQFN variant adds GPIO count and suits industrial packaging preferences, while the WLCSP targets minimum footprint in products such as smart rings, smartwatches, fitness bands and VR glasses.

Integrated functions and configurability

The SLG46801 integrates the following on-chip resources, according to Renesas:

  • Two high-speed analog comparators
  • Configurable lookup tables, counters and delays
  • 10kHz and 25MHz oscillators
  • Voltage-tolerant GPIOs, dynamically repurposable for the I2C interface
  • An I2C-compatible serial interface

Renesas states the device operates and can be programmed across a 1.71V to 5.5V supply range, which it describes as the widest among its multi-time programmable GreenPAK devices. The part includes multi-time programmable non-volatile memory that can be reconfigured in-system via I2C, which Renesas says allows bug fixes and configuration updates after deployment, reducing the need for hardware redesign. Optional CRC-8 and read-back protection are included for configuration integrity.

Packages, tools and availability

Renesas says the SLG46801 is intended to complement an MCU or replace multiple discrete components, supporting sensing, control, glue-logic and system housekeeping tasks. The device is configured using the free Renesas Go Configure Software Hub, which the company says avoids the need for additional discrete components or complex firmware.

According to Renesas, the STQFN package is sampling now, while the WLCSP package is planned for mass production in November 2026. Renesas also states the device offers one of the lowest costs per GPIO in the GreenPAK family, a vendor claim not independently verified.

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