Renesas GaN device adds dual-side cooling for 800V AI racks

Renesas has launched the TP65H020G4PLSGBD, a 650V GaN device the company describes as the industry's first with dual-side cooling, targeting high-density power conversion in 800V HVDC AI data centre architectures. The device is currently sampling to major AI data centre OEMs and ODMs, with mass production planned for mid-2027, according to Renesas.

Package and electrical figures

Built on Renesas' Gen IV Plus GaN architecture, the D-mode device carries an on-resistance of 20 milliohms, which Renesas states is one of the lowest in its class, housed in an 8 x 8mm PQFN package.

• Package footprint 57% smaller than Renesas' existing 10 x 15mm TOLT package, per company figures
• Top-side thermal impedance lowered by 10% compared with conventional top-side-cooled packages, Renesas states
• Rated for operation supporting up to 700V, targeting 800V DC/DC intermediate bus converter stages stepping down to 48V, 12V or 6V

Renesas says the device retains characteristics of its Gen IV Plus GaN line, including low gate charge and output capacitance, a built-in freewheeling diode with minimal reverse recovery, and a high threshold voltage that avoids the need for negative gate bias. This allows use of a standard silicon gate driver rather than a specialised E-mode driver, the company states.

Reference design results

Renesas reports that a 6kW, 800V-to-48V LLC DC transformer reference design, built on the new device and controlled by its RA6T3 MCU, reached a power density of 2.6 kW/in³. Per-module testing measured full-load efficiency 0.21% higher than an equivalent TOLT-based board, according to Renesas. The company also cites 800V-to-12V and 6V DC/DC intermediate bus converter reference designs using the same DSC platform, claiming similar performance and density gains, though these figures are Renesas' own reported results rather than independently verified data.

The dual-side-cooled PQFN package was defined in collaboration with major AI infrastructure customers to establish a standard footprint, Renesas says, intended to give buyers sourcing flexibility alongside the company's AUX controllers, gate drivers and MCUs for 800V architecture designs. Renesas will show the device at the OCP Global Summit in San Jose, California, from 12 to 15 October.