Parker Chomerics adds low-bleed thermal gap pad rated 12.0 W/m-K
The Chomerics Division of Parker Hannifin is releasing THERM-A-GAP PAD 120LOE, a thermal gap filler pad with a thermal conductivity of 12.0 W/m-K alongside what the company describes as exceptionally low silicone oil bleed and migration. The 'LOE' designation stands for Low Oil Enhanced, reflecting a formulation developed under established test methods to reduce bleed and migration, which Parker says can otherwise present aesthetic or manufacturing challenges in some applications.
The pad has a hardness of 45 Shore 00 (ASTM D2240), giving what Parker describes as excellent stress relaxation and very low compressive force on sensitive components such as integrated circuits, while maintaining thermal contact across uneven surfaces or gaps and providing vibration damping and physical protection. A high-tack surface is intended to reduce thermal contact resistance while the material remains electrically isolating.
Electrical properties include a dielectric strength of 8 kVAC/mm (ASTM D149), volume resistivity of 10^14 Ω-cm (ASTM D257), dielectric constant of 6.0 (ASTM D150) and dissipation factor of 0.0001 (CHO-TM-TP13), the latter two measured at 1,000 kHz and 1.2 mm thickness. The material carries a UL 94 V-0 flammability rating, is RoHS compliant, and is rated for an operating temperature range of -50°C to +200°C.
Parker lists target applications including GPUs, CPUs and memory modules, network and 5G/telecommunications equipment, automotive sensors and electronics, battery and energy storage modules, and defence systems. THERM-A-GAP PAD 120LOE is available in standard thicknesses from 1 mm to 5 mm, supplied as sheets measuring 254 x 381 mm or as custom die-cut parts, individually or on sheets, with bespoke widths, lengths and part sizes available on request. Parker Chomerics is due to show the material at electronica 2026, on stand B3-457.
