Winbond expands 16nm DRAM range with new DDR4 and LPDDR4 densities
Image: Winbond via Coastal PR
Winbond has expanded its 16nm DRAM portfolio with 8Gb LPDDR4 in an x16 configuration, 16Gb LPDDR4 in an x32 configuration and 16Gb DDR4 products. The additions extend the range of memory densities available for different system requirements and product tiers.
The company says the expanded range fills density gaps in its DDR4 and LPDDR4 offerings. Compared with 8Gb devices, the 16Gb products provide twice the density per device, potentially allowing the same total memory capacity with fewer components and reduced board space.
The new 16Gb DDR4 products target applications including switches and server peripherals. The 16Gb LPDDR4 products are aimed at automotive systems and AI image signal processing applications, including drones and surveillance systems.
“The expansion of our 16nm DRAM portfolio is an important step toward providing customers with more complete density coverage,” said Winbond. “Customers increasingly need different memory configurations across product tiers and applications. By expanding our DDR4 and LPDDR4 portfolio, we can support a broader range of customer products and provide greater flexibility during the design-in process.”
Winbond describes its 16nm DRAM platform as designed for low power consumption and stable high-speed performance. It also says the process increases the number of memory units produced from available wafer capacity. No comparative power or performance figures were supplied in the announcement.
The new 16Gb DDR4 and 16Gb LPDDR4 products are scheduled to become available by the end of 2026, with mass production planned for the second quarter of 2027.
