Bosch creates a semiconductor division and opens more fab capacity to external customers
Bosch will establish a dedicated Semiconductors division on 1 January 2028, separating chip operations from the electronic control unit and power electronics activities currently grouped in Mobility Electronics. The division will remain within Bosch Mobility, with a semiconductor sales target of approximately €5 billion by 2030.[1]
Alongside the reorganisation, Bosch plans to open more manufacturing capacity to external partners and expand its foundry business. It identifies MEMS sensors, SiC power devices and ASICs as its main strengths, with robotics among the markets it wants to develop beyond its automotive and consumer applications.[1]
The company’s semiconductor network spans roughly 40 research, development and manufacturing locations. Bosch says it has invested about €3 billion in Dresden and Reutlingen, with a further $2 billion being used to equip Roseville, California for SiC production.[1]
Its Penang test centre is due for expansion by the middle of the next decade, and Bosch also holds 10% of ESMC, the TSMC-led joint venture building a fab in Dresden. From January 2028, Mobility Electronics will retain the automotive electronic control unit business as the chip operations transfer to the new division.[1]
Sources
A technician working in a semiconductor cleanroom. Illustrative photograph, not a Bosch facility. Photo: L N / Unsplash. Photo source. Free Unsplash licence.
