SEMIFIVE signs Mobilint robotics AI chip contract
Illustrative image: Unsplash contributor on Pexels
SEMIFIVE has signed a turnkey development contract with South Korean AI semiconductor company Mobilint to develop a chip for robotics applications.
Announced on 1 October, the project forms part of South Korea’s K-On-Device AI Semiconductor Technology Development programme. The programme supports collaboration between semiconductor businesses and end users to develop and validate application-specific chips.
The planned device is intended to process vision and sensor data locally, including in agricultural robots operating where connections to external servers are limited.
SEMIFIVE said the design will incorporate LPDDR6 memory support, PCIe Gen6 and UCIe-S, an interconnect for linking chiplets within a standard package.
The contract uses SEMIFIVE’s “Spec Hand-off” model. Mobilint defines the principal specifications and performance targets, while SEMIFIVE takes responsibility for detailed design, packaging, testing and mass-production services.
The companies have not disclosed the process node, compute target, power budget or production schedule. The announcement concerns development of the device, rather than a completed chip.
