GlobalFoundries signs $2bn TSMC agreement for US-made silicon interposers
GlobalFoundries has announced a $2bn manufacturing agreement with TSMC to establish a US supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
The agreement, announced on 8 October, will expand fabrication capacity at GlobalFoundries' Malta facility in New York. GlobalFoundries will provide manufacturing services to TSMC for packaging used in high-performance computing and AI systems.
The planned capacity includes silicon interposers supporting embedded deep trench capacitor components. GlobalFoundries said it expects the expansion to establish the first US-based source of these interposers.
Malta is GlobalFoundries' headquarters and a large-scale 300mm wafer manufacturing site. Its existing technology portfolio includes FD-SOI, FinFET, RF-SOI and silicon photonics. Construction began in 2009.
In 2025, the company announced plans for an Advanced Packaging and Photonics Center within the New York facility, covering advanced packaging and testing of US-made chips.
The TSMC agreement has an initial five-year term and provides for further capacity expansion as customer demand grows. Volume production at Malta is expected to begin ramping in the first half of 2028.
