Infineon signs 200mm SiC wafer deal with Wolfspeed
Image: Infineon
Infineon Technologies and Wolfspeed have signed a new multi-year supply agreement covering 200-millimetre silicon carbide (SiC) wafers, transitioning their existing supply relationship from 150-millimetre substrates. Infineon describes the agreement as supporting its conversion to 200mm SiC manufacturing and broadening its substrate supply base.
According to Infineon, the deal builds on a 20-year supply relationship between the two companies and is intended to strengthen supply chain resilience while adding flexibility and scalability for future growth. The company did not disclose volumes, pricing or contract duration.
Why the wafer size matters
Infineon states that moving from 150mm to 200mm SiC wafers increases usable die area per wafer, reduces per-unit substrate cost and improves manufacturing efficiency. These are company claims rather than independently verified figures, and no specific cost or yield data were provided.
Infineon operates what it calls a multi-source SiC substrate strategy across its global manufacturing network, including a 200mm SiC fab in Kulim, Malaysia, which the company describes as designed to be the world's largest and most competitive silicon carbide manufacturing facility.
Demand drivers cited
Infineon points to electric vehicle drivetrains, renewable energy systems, solar inverters, industrial motor drives and AI datacentre power infrastructure as applications driving SiC demand. The company says AI datacentres are emerging as a significant demand driver for SiC power semiconductors, citing power conversion efficiency as a direct operating cost consideration for hyperscalers, and describes SiC's switching efficiency and thermal performance as technically suitable for power conversion stages where silicon reaches its practical limits. These statements are attributed to Infineon.
Alexander Gorski, Chief Operations Officer at Infineon, said the agreement broadens the company's supply base for 200mm high-volume manufacturing and strengthens supply chain security for customers. No details were given on when 200mm wafer volumes under this agreement will begin flowing into production.
