Fujifilm invests $18m in Arizona CMP slurry expansion
Image: Fujifilm. Archive photograph of the existing Mesa facility, 2022; not the new production line.
Fujifilm is investing approximately $18m to expand chemical mechanical polishing slurry production at its Mesa, Arizona, facility, with the additional line expected to begin operating in 2027.
The investment will increase production capability for copper CMP slurries used in back-end-of-line semiconductor processing. It will also support multiple products for front-end and middle-of-line applications, hybrid bonding and advanced packaging.
CMP combines chemical action and mechanical abrasion to planarise surfaces during semiconductor fabrication. Slurry formulations must accommodate the materials being removed and the selectivity required between adjacent layers.
The Mesa development will connect Fujifilm’s local research and development work with larger-scale production, supporting the transfer of new formulations into manufacturing.
Fujifilm has not specified a percentage increase in output. The new line is intended to manufacture a broader range of products alongside the site’s existing semiconductor-materials operations. [Source 1]
