FormFactor and Teradyne agree semiconductor test collaboration and $300 million investment
Teradyne has agreed to invest $300 million in FormFactor through a purchase of common stock, alongside a technology collaboration covering semiconductor development, validation and production testing.
The agreement brings together FormFactor's probe technologies, test interfaces and device-characterisation work with Teradyne's automated test platforms. The companies identified high-performance computing, high-bandwidth memory, advanced packaging and silicon photonics among the applications the collaboration will address.
Their planned work includes developing test architectures, optimising test infrastructure and preparing emerging devices for high-volume production. The announcement also provides for joint engagement with customers using the two companies' technologies.
Teradyne chief executive Gregory Smith said the combination would help build a more complete path to production for shared customers. FormFactor chief executive Mike Slessor linked the agreement to increasingly demanding requirements for test performance and scalability.
The equity transaction remains subject to customary closing conditions and regulatory approvals.
