Electronics manufacturing & test
NEPCON Japan 2027
Electronics production in Tokyo, from PCB assembly and test to chip and sensor packaging.
The February edition of NEPCON Japan brings eight specialist exhibitions together at Tokyo Big Sight. The show covers printed wiring boards, electronics manufacturing services, test and inspection, IC and sensor packaging and power modules. That mix is useful if you’re taking a design into production. You can look at assembly options and speak to test equipment suppliers during the same visit, while there’s still time to resolve any issues with board layout or test access.
Event information reviewed 8 November 2026.
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See the organiser’s website for registration, opening hours and the current programme.