Advanced packaging, components & reliability
IEEE ECTC 2027
The 77th Electronic Components and Technology Conference, focused on packaging and microelectronic systems.
Packaging as a system decision
The 77th IEEE Electronic Components and Technology Conference runs on 1–4 June 2027 at the Gaylord Rockies Resort & Convention Center in the Denver area. Sponsored by the IEEE Electronics Packaging Society, ECTC brings together packaging, components and microelectronic systems research, education and an industry exhibition.
Research, reliability and the exhibition
Its relevance extends from advanced packaging and heterogeneous integration to assembly, materials and reliability. For engineers assessing chiplet-based systems, the useful questions include interconnect performance, thermal limits, manufacturing variation and qualification. The 2026 edition featured 115 exhibitors; that is a previous-edition figure, not a confirmed count for 2027. Check the developing technical programme and current exhibition list before arranging meetings.
From packaging research to implementation
The 2027 conference is at Gaylord Rockies Resort & Convention Center in the Denver area. For packaging discussions, bring the constraints behind your application: interconnect density, thermal limits, materials, assembly and reliability. Check the current programme for technical sessions and separate course or registration requirements.
Event information reviewed 23 October 2026.
Our coverage
See the organiser’s website for registration, opening hours and the current programme.