Hyundai Mobis starts 13 automotive chip projects with Korean partners
Hyundai Mobis is developing 13 chips through its Auto Semicon Korea programme, with target vehicle models selected for nine. The work follows 19 collaboration proposals for system semiconductors identified with Korean companies. The programme brings automaker requirements into chip development earlier, including controller functions, quality requirements and deployment schedules. Its scope is expanding from fabless designers and foundries to software, design IP, packaging, testing and functional safety.
The new projects add to an existing manufacturing programme. Hyundai Mobis says it already produces 16 types of internally designed system semiconductor through external foundries, at a combined annual volume of 20 million units. They cover power supply, actuation, communication, sensing and data processing.
Auto Semicon Korea now includes 53 companies and institutions, up from 27. A coordinating body will assign owners and schedules to the projects and track their progress through development, verification and production.
