Wireless, robotics and power electronics on show at electronica 2026

Image: © Messe München. Archive photograph from electronica 2024, not the forthcoming 2026 exhibition.
Electronica opens at Messe München on 10 November, with about 3,500 exhibitors expected across 18 halls including the co-located SEMICON Europa. The four-day trade fair runs until 13 November. [1] [2]
Bluetooth throughput and satellite testing
Nordic Semiconductor will show a silicon prototype of Bluetooth High Data Throughput, an upcoming feature for Bluetooth Low Energy. The company says the feature could increase the maximum transfer speed to nearly four times that of existing Bluetooth LE by supporting longer packets and carrying more data per transmission. Nordic is targeting devices such as wearables and hearing aids that use Bluetooth LE to move data within a limited power budget. [3]
Qualinx plans to demonstrate a GNSS receiver that it rates at 1 mW for applications including wearables and asset trackers. In Hall A4, Rohde & Schwarz will show a testbed for low Earth orbit satellite links that uses a robotic arm to reproduce satellite movement. The setup allows phased-array beam steering to be tested as the position of the target changes. [4] [5]
Robotic control and embedded processing
Microchip’s robotics demonstration uses Bluetooth LE and single-pair Ethernet to control a set of robotic hands. A camera captures a hand gesture and the data travels over Bluetooth LE to a PIC32 BZ6 microcontroller, which bridges it onto a 10BASE-T1S Ethernet segment. [6]
Future Electronics will demonstrate a sensor-fusion robot running ROS on a Renesas RZ/V2N processor. It will also show an indoor positioning system that uses an NXP SR250 and a Murata ultra-wideband module for ranging. STMicroelectronics is bringing a modular drone platform that combines navigation, motion control and power electronics. [7] [8]
At Astute Group, the programme includes Axelera AI’s Metis inference hardware for machine vision and an XMOS far-field voice processing design using Sensory’s wake-word technology. The distributor’s line-up also includes SCI Semiconductor, whose CHERI-based processors use hardware to enforce memory access bounds. [9]
Thin-film batteries and optical sensing
Swiss start-up BTRY will show its thin-film solid-state batteries in the Fast Forward area. The company says the cells are less than a millimetre thick and can operate at up to 150 °C. It is working with InsightSilica to adapt and validate the technology for semiconductor manufacturing environments. [10] [11]
Fraunhofer IIS plans to demonstrate a test-strip reader based on its nanoSPECTRAL technology, which integrates optical nanostructures directly into CMOS. The chip-scale spectrometer has 320 channels spanning visible to near-infrared wavelengths. [12]
Data centre infrastructure and power conversion
Keysight will demonstrate how it validates 1.6 Tb/s optical and electrical interconnects for data centres, including measurements at 100 and 200 Gb/s per lane. Onsemi will cover power delivery from the grid to the processor core through a display of reference designs and application boards. [13] [14]
At Future Electronics, the power conversion demonstrations include a digitally controlled dual buck converter with a 240 W USB-C Power Delivery input, 80 V gallium nitride devices and an Infineon PSoC C3. The distributor will also show a 3 kW AC-to-DC design that uses onsemi silicon carbide MOSFETs and controllers. [7]
Exhibitor stands
- Rohde & Schwarz, A4 / 307 – Satellite motion and phased-array beam steering
- Keysight, A4 / 506 – 1.6 Tb/s interconnect test
- BTRY, B4 / 251/15 – Thin-film solid-state cells
- Qualinx, C2 / 626 – Low-power GNSS
- STMicroelectronics, C3 / 101 – Modular drone platform
- Future Electronics, C3 / 321 – Sensor-fusion robot and power converters
- onsemi, C4 / 101 – Data centre power distribution
- Microchip, C5 / 121 – Gesture-controlled hands
- Fraunhofer IIS, C5 / 241 – Live test-strip readout
- Astute Group, C5 / 421 – Local inference, voice processing and hardware security
- Nordic Semiconductor, C6 / 159 – Bluetooth High Data Throughput prototype


