Electronics manufacturing & packaging
Electronics Manufacturing & Packaging Symposium 2027
PCB assembly, component packaging and reliability for space and other high-reliability electronics.
Manufacturing and packaging for demanding systems
The Electronics Manufacturing & Packaging Symposium takes place at ESA/ESTEC in Noordwijk from 28 June to 1 July 2027. Professional-development courses are held on 28 June, followed by the symposium on 29 June–1 July.
High-reliability lessons beyond space
The programme covers printed circuit boards, electronic assembly, packaging technologies and reliability. Although space electronics is central, the organiser also includes defence, automotive, medical and data-infrastructure applications. Look for process evidence, failure mechanisms, qualification methods and production controls that transfer to your own reliability requirements.
Event information reviewed 1 November 2026. Official organiser information →
See the organiser’s website for registration, opening hours and the current programme.