High-speed design & test
DesignCon 2027
Chip, board and system design, with signal and power integrity at its centre.
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Why it belongs in your diary
A focused option for engineers working on high-speed interfaces, interconnects, packaging and measurement. The conference runs 2–4 February; the exhibition runs 3–4 February.
What to look for
Prioritise sessions and suppliers relevant to actual interface speeds, stackups and test constraints. Look for measurement-backed design guidance that can be applied to a current project.
An independent editorial listing from The Electronics Brief. Dates checked against organiser information on 22 September 2026. Confirm opening hours, admission and programme details with the organiser before booking.